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High-Frequency PCB
Introduction to High-Frequency PCB
High-Frequency Printed Circuit Board Materials:
To achieve the optimal performance of our high-frequency PCBs at Blind Buried Circuits, our experienced manufacturing engineers select the suitable material depending on the application signal speed ranges and use the best substrate for your designs.
Regarding the cost of material, it is well known that Teflon is the most expensive material used to fabricate high-frequency PCBs. However, FR-4 tends to be slightly cheaper but limited to certain signal ranges. With limitations up to 1.6 GHz, FR-4 considerably drops the signal speed. In comparison, Teflon has a very low value for Dk, Df, and water absorption, making it survive in the most challenging environments.
Considering the frequency requirements, we use different substrates and Teflon for frequencies above 10 GHz. Our approved suppliers for high-frequency materials include Arlon, Taconic, Nelco, Isola, Rogers, and Teflon. They all are specialized in manufacturing low Dk and Df materials for high-frequency boards.
Please complete our quote form now and select your desired material for a quick quote for your high-frequency PCB.
| PCB MATERIAL/SUBSTRATE | ||
|---|---|---|
| RF & Microwaves | ROGERS 4350B, 4003C, 4450F , ROGERS 4835 | |
| OUTER LAYER LINE & SPACING | ||
| STANDARD | ADVANCED | |
| Min. Trace/Space | 2.5mils / 2.5mils | 2mils / 2mils |
| Line Tolerance | +/-15% | +/-8% |
| INNER LAYER | ||
| STANDARD | ADVANCED | |
| Min.Trace/Space | 2mils / 2mils | 1.5mils/1.5mils |
| Line Tolerance | +/-10% | +/-8% |
| BOARD DIMENSIONS | ||
| DESCRIPTION | STANDARD | ADVANCED |
| min. Finish Board Size | 0.2"x0.2" | 0.15"*0.15" |
| Max. Board Thickness | 0.260"(+/-10%) | 0.280"(+/-8%) |
| Min. Board Thickness | 0.007"(+/-10%) | 0.005"(+/-10%) |
| LAMINATION | ||
| DESCRIPTION | STANDARD | ADVANCED |
| Layer Count | 1L to 50L | 60L |
| SURFACE FINISH | ||
| DESCRIPTION | STANDARD | ADVANCED |
| HASL+Selective Hard gold | Yes | Yes |
| Selective ENIG+OSP | Yes | Yes |
| ENIG(Nickel/Gold) | 80-200u"/2-9 u" | 250u"/ 10u" |
| Immersion Silver | 6-18u" | 6-18u" |
| Hard Gold for Tab | 10-80u" | 10-80u" |
| Immersion Tin | 30u"min. | 30u" min. |
| ENEPIG (Ni/Pd/Au) | 125u"/4u"/1u" min. | 150u"/8u"/2u" min. |
| Soft Gold (Nickel/ Gold) | 200u"/ 20u"min. | 200u"/ 20u" |
| SOLDER MASK / RESIST | ||
| DESCRIPTION | STANDARD | ADVANCED |
| S/M Thickness | 0.4mils min. | 2mils max. |
| Solder dam width | 4mils | 3mils |
| SILK SCREEN / LEGEND | ||
| DESCRIPTION | STANDARD | ADVANCED |
| Min. Space to SMD pad | 6mils | 4mils |
| Min. Stroke Width | 6mils | 5mils |
| Min. Space to Copper pad | 6mils | 4mils |
| Max Width | 28 mils | |
| Available Color | White | Black, Yellow, Red, Blue, Green |
| ELECTRICAL TESTING | ||
| DESCRIPTION | STANDARD | ADVANCED |
| Max. Test Points | 30000 Points | 30000 Points |
| Smallest SMT Pitch | 18mils(0.45mm) | 12mils(0.3mm) |
| Smallest BGA Pitch | 12mils(0.3mm) | 6mils(0.15mm) |
| Testings Types | AOI, Flying probe Test, Bed of Nails, High Potential Test (HP-1000V) | |
| IMPEDANCE CONTROL REQUIREMENT | ||
| DESCRIPTION | STANDARD | ADVANCED |
| Impedance Controlled | Yes (+/-10% tolerance) Single & Diffrential Ended |
Yes (+/-5% tolerance) Single & Diffrential Ended |
| SPECIAL PROCESS | ||
| DESCRIPTION | STANDARD | ADVANCED |
| Via Tenting, plugging and filling | Solder Mask, Non-conductive Epoxy, Microvia Filling, Conductive Copper Pastes Single & Diffrential Ended |
|
| Peelable Solder Mask / Carbon Ink | Yes | |
| Gold Fingers | Yes (Gold-plated Connectors w/wo Wires) | |
| Edge Plating | Yes (Edge Plating, Castellation, Controlled Depth Cavity) | |
Blind Buried Circuits High-Frequency PCB Capabilities
- Materials: Arlon, Taconic, Nelco, Isola, and Rogers
- Minimum Board Thickness: 0.011″ to 0.0039″
- Maximum Board Thickness: 0.393″
- Aspect ratio: 20:1
- Minimum Mechanical Drilling: 6 mils
- Maximum Layer Counts: 22 layers
- Minimum Line Width: 2.5 mil
- Minimum Line Spacing: 2.5 mil
- Surface Finish: Leaded HASL, Lead-free HASL, ENIG, Immersion silver, Immersion Tin, OSP, ENEPIG, and bare copper
- IPC Class: 2 and 3
High-Quality Material and Exceptional Manufacturing Lead Times:
Blind Buried Circuits is the industry leader in manufacturing High-Quality HF PCBs. Our decade of experience manufacturing HF boards ensures that our material is of the low Dk and Df value the customer chooses. This helps us minimize the signal loss and maintain the Impedance requirements per the customer-provided impedance chart without increasing the manufacturing lead time.
Who Are Our Customers?
- Advanced communication systems
- Military industry
- Radar systems
- Medical systems
- Pressure measurement systems
- 3D printing and other gadgets
- Power indicators of solar panels, inverters, and generators
- Submarines, Ships, and other marine Machines
- Automotive Industry (specifically LIDAR, which is a mini radar that communicates a vehicle’s surroundings)