PCB GLOSSARY
TERMS OF GLOSSARY:
PCBs (Printed Circuit Boards) are obtainable with diverse factors and components that make their performance special and individual. The Blind Buried Circuit offers comprehensive PCB manufacturing and assembly services to numerous industrial sectors including Medical, telecommunications, Aerospace, Defense, Consumer Electronics, Renewable Energy, and more.
A
Automatic Test Equipment (ATE):
The equipment that inevitably scrutinizes practical or static parameters in sequence to assess performance is known as Automatic Test Equipment (ATE).
Automated Optical Inspection (AOI):
The visual inspection of the PCBs using a machine scanner to evaluate workmanship caliber is known as Automated Optical Inspection (AOI).
Assembly:
An Assembly is a number of subassemblies, parts , or any amalgamation thereof associate together is known as assembly.
Aspect Ratio:
The ratio of the PCB broadness and diameter of the smallest hole is known as aspect ratio.
Artwork:
The artwork is precisely scaled configuration that is used to produce the production master or artwork master.
Artwork Master:
The glass plate or a photographic film that personify the image of the printed circuit board (PCB) pattern, commonly on a 1:1 scale.
Array:
A group of elements or circuits (circuit board) that are organized in rows and columns on a base material is known as an array.
Annular Ring:
The portion of dynamism material surrounding a hole is known as an annular ring.
Aperture Information:
It is a text file characterize the size and shape of each component on the board is called Aperture Information. These are also known as D-code lists. These lists are not essential if your files are saved as extended Gerber with installed Apertures (274x).
Activating:
Activating is a regimen that provide nonconductive material approachable to electroless deposition.
Additive Process:
It is a process for attaining conductive patterns by the discriminatory deposition of conductive material on clad or unclad base material.
b
Burr:
A rim left on the outside copper surface after drilling is known as a Burr.
Buried Via:
A Via hole that does not expand to the surface of a printed circuit board is known as Buried Via.
Bow:
A departure from flatness of a board, identify by approximately cylindrical or spherical curvature such as; if the board is rectangular than its four corners are in the same plane.
Book:
A specified number of prepreg piles which are convene for curing in a lamination press is called Book.
Bond Strength:
The force per unit area is mandatory to separate two adjacent covers of a board by a force perpendicular to the board surface is known as bond strength.
Board Thickness:
Blind Buried Circuit standard base thickness is 1/16 inch, which is also known as 0.062. We also proffer many other compactness. A typical resilience is within 10% of the given thickness.
Blister:
A localized bloating and disaffiliation between any of the layers of a glazed base material, or in the middle of base material or conductive foil. It is a form of exfoliate. It is called Blister.
Blind Via:
It is a conductive surface hole that joins or connects an outer layer with an inner layer of a multi-layer board without stifling the entire board, it is known as Blind Via.
Build Time:
The blind Buried Circuit operates on a 10-hour clock, 5-days week (posted holidays and weekends are not counted). The cessation time for receiving orders and files is 5p.m. EST. Sometimes to navigate the web the files have been known to take 45 minutes, so please tolerate for this.
Bleeding:
A condition in which a plated hole exudes process materials of solutions from vacant and crevices is known as Bleeding.
Bed-Of-Nails Fixture:
A test fixture is consisting of a frame and a holder accommodating a field of spring-loaded pins that make electrical connections or contact is called a Bed-of-nails fixture.
Base Material:
The insulating object upon which a conductive pattern may be formed. It may be flexible or rigid or can be both. It may be an insulated or dielectric metal sheet. It is called Base material.
Base Material Thickness:
The thickness of the base material prohibiting metal foil or material deposited on the surface is known as Base Material Thickness.
Base Copper:
The thin copper foil segment of a copper-clad surface for PCBs (Printed Circuit Boards). It can be present on both side or one side of the board.
Barrel:
A cylinder devised by plating through a drilled hole is called a barrel.
Backup Material:
A layer contains paper composite, phenolic, or aluminum foil-clad fiber composite used during fabrication to protect the drill table and to prevent briar is called backup material.
B-Stage Resin:
A thermosetting resin that is in an intervening state of cure is called as B-Stage Resin.
B-Stage Material:
A B-Stage Material is a sheet material which is infused with a resin cured to an intervening stage (B-Stage Resin). Prepreg is the approved term.
C
Cut Lines:
The cut line is going to be used to perform the router path and it represents the board outside edge. Our route liberality is +/- 0.010″. It is advocated to keep outer cover copper 0.01″ and inner copper 0.025″ from the cut line to evade connection with the board edge.
Curing:
The act of applying heat to a material in order to manufacture a bond is called curing.
Coefficient Of Thermal Expansion (CTE):
The expand and contract of all materials by the help of change of temperature is called as coefficient of thermal expansion.
Core Thickness:
The width of the laminate base without copper is called Core Thickness.
Copper (Finished Copper):
This is how much the copper on your board will have on its surface. It is the copper foil width, minus surface preparation, plus plated copper. It is given in oz / per sq foot. A minimum of 0.0012″- 0.0014 width = 1 oz . We offer finished copper of 1-oz, 1.5-oz, 2-oz, 2.5-0z. If you need a disparate finished copper amount, please complete our PCB RFQ (Request For Qoute) form.
Controlled Impedance:
The matching of substrate material effects with trace locations and dimensions to produce a particular electric blockade as seen by a signal on the trace is known as Controlled Impedance.
Connecter Area:
The segment of a PCB that is used to supplies electrical connection is known as Connecter Area.
Conformal Coating:
It is an insulating protective coating that comply with the configuration of the object coated and it is applied on the completed board assembly.
Conductor Thickness:
The width of the conductor including all metallic coatings is known as conductor Thickness.
Conductor Spacing:
The space between two adjacent corners (not centerline to centerline) of isolated conductive figure in a conductor cover is called conductor spacing.
Conductor:
A slender conductive area on a printed circuit board (PCB) exterior layer or internal layer usually imperturbable of lands (to which element leads are connected) and track (traces). It is known as Conductor.
Computer-Integrated Manufacturing (CIM):
CIM is a software that contains assembly data from a CAM or CAD package and, applying a pre-defined factory modeling system, outputs annexation of elements to machine performing points and assembly and scrunitizes documentation.
Computer–Aided Manufacturing (CAM):
The use of computer to evaluate and transfer an electronic design (CAD) to the fabricating floor is known as CAM.
Computer-Aided Design (CAD):
A software program with algorithms for delineation and modeling, supplying a graphical representation of a PCBs (Printed Circuit Board) conductor layout and signal direction is known as (CAD) computer-aided design.
Component Side:
The side of the PCB on which most of the element will be occupied is known as component side and it is also called the “top side”.
Component Hole:
A hole which is used for coupling and electrical attachments of a element cessation, such as wire or pin is connected to the circuit board.
Component:
An electronic device, typically a capacitor, inductor, resistor or integrated circuit (IC) that is saddle to the PCB and accomplish a particular electrical function is called as Component.
Clearances:
A clearance (or solitude) is a term we use to explain the distance from power/ground layer copper to through a hole. To avoid shorting, power and ground clearances need to be .025 bigger than the finish hole size for the inner layers. This concede for drilling, registration, and plating impartiality.
Clean Room:
A room in which the airborne particles and concentration is composed to restrict limits is known as clean room.
Clad Or Cladding:
A clad is an approximately slender layer or sheet of foil that is connected to a laminate core to produce the base material for PCBs.
Circuitry Layers:
A layer of a PCB consist of conductors including voltage, planes, and grounds is called circuitry layer.
Circuit:
The number of interconnections of devices in one or more closed paths to accomplish a desired electronic or electrical functions is called circuit.
Chamfer:
A broken corner to eradicate an otherwise sharp edge is known as chamfer.
CEM1 Or CEM3:
The CEM stands for composite epoxy material, CEM1 and CEM3 are fiberglass/epoxy over a paper core, dissenting only in the type of paper used. These materials are more punchable substitute for FR4, and less expensive. It is not a military grade material.
Capacitance:
The equity of a system of dielectrics and conductors that allows storage of electricity when the potential difference present between conductors.
C-Stage:
The plight of a resin polymer with high molecular weight when it is in a solid state is called C-Stage.
D
Dry-Film Solder mask:
A Coating apparatus (dry-film resist) is applied to the PCB (printed circuit board) by the process of lamination to shield the board from solder or plating is known as a Dry-film Solder mask.
Dry-Film Resist:
It is a coating material specifically intended for used in the assemble of PCBs (Printed Circuit Board) and synthetically machined parts. They are resistant to disparate electroplating and etching process, and are appropriate for all photomechanical operations. It is called Dry-Film Resists.
Drilling:
The act of creating holes by mechanical or laser means in a substrate is called drilling.
Drill Tool Description:
It is a text file explaining drill tool number, quantity, corresponding size, and if the holes are to be non-plated or plated. It is called a drill tool description.
Drill File (Excellon Drill File):
A drill file has X and Y corresponds with tool sizes conspicuous in any text editor. It is the file that manages your finished hole sizes.
Drawing or Print:
A print or drawing generally involves an outline of the PCB board, fabrication notes, dimensions, and a drill chart with legend.
Double-Sided Board:
A conductive pattern on both sides of a printed board is known as Double-Sided Board.
Dimensional Stability:
A measure of the spatial change of a material that is caused by the circumstances such as chemical changes, temperature changes, stress exposure and humidity changes.
Digitizing:
The changing of aspect location on a flat plane to a digital representation in X-Y corresponds is called digitizing.
Dielectric:
The dielectric is an insulating medium that takes place in the region between two conductors.
Dewetting:
A plight that results when a molten solder has covered a surface and then retract, leaving irregular shape pile detached by areas coated with a slender solder film and the base material is not liable.
Desmear:
The drilling of debris from a hole wall and removal of friction-melted resin is called as Desmear
Design Rule:
The automatic conductor routing that is determine by the guidelines with respect to described design parameter is known as a design rule.
Design Rule Checking:
The use of a computer program to accomplish constancy verification of all conductors that are routing with according to suitable design rules. It is called design rule checking.
Delamination:
The separation of the base between any of the layers of laminate or between the laminate and the metal cladding proceed from or protracting to the edge of board or edges of a hole. It is known as delamination.
Definition:
The allegiance of the reproduction of pattern edges, specifically in a PCB (Printed Circuit Board) related to the original master pattern. It is called Definition.
Defect:
Any disapprobation to stated requirements by the product or unit is called defect.
Deburring:
The process of abolishing burrs after drilling is known as deburring.
Data Code:
This alternative will have us a place in the year and week of fabricate on your board. It can be etched on the part of the silkscreen or on the board.
E
Excellon Drill File:
The type of drill file that Blind Buried Circuit will accept is known as Excellon Drill File.
Etching:
The chemical and electrolytic, eradication of undesirable portions of conductive materials.
Etchback:
The composed eradication of all elements of the base material by a chemical process performing on the sidewalls of plated-through holes to exhibit additional internal conductors area. It is called Etchback.
Epoxy Smear:
It is an epoxy resin which is conveyed on corners of copper in holes during drilling each of as uniform coating or in dispersed patches. It is inadmissible because it can isolate the conductive layers electrically from the plated-through-hole interconnections.
Epoxy:
The family of thermosetting resins is called epoxy. Epoxies makes a chemical bond to many metal surfaces.
Entry Material:
A slender layer of material which is made up of aluminum foil, phenolic, or paper which is placed on top of the panel prior for drilling to ameliorate drill accuracy and prohibits dents and burrs. It is called an entry material.
ENIG:
The ENIG stands for Electroless Nickel under Immersion Gold finish. The Blind Buried Circuit offers ENIG finish for customers with lead-free product requirements.
Electroplating:
The electrodeposition of an adherent metal covering on a conductive material. The material to be plated is placed in an electrolyte and linked to one terminal of a DC (direct current) voltage authority. The metal to be forwarded is similarly consumed and linked to the other terminal. It is called electroplating.
Electroless Copper:
A slender layer of a copper is forwarded on a plastic or metallic surface of a PCB (Printed Circuit Board) from an autocatalytic plating solution (without use of electrical current). It is called electroless copper.
Electrical Test:
The electrical testing is a testing which is used mainly to test for shorts and opens. Blind Buried Circuits offers testing for multilayer orders (4 layers and up) and for all surface mount boards.
F
FR1:
A FR1 is a paper object which comes with a phenolic resin binder. It has a Tg of about 130 degree centigrade. BBC (Blind Buried Circuit) does not offers FR1.
FR2:
A FR2 is also a paper object which comes with a phenolic resin binder, it is similar to FR1 but it has a Tg of 105 degree centigrade. BBC (Blind Buried Circuit) offers FR2 for only single sided boards.
FR3:
A FR3 is a paper material that is parallel to FR2, but in FR3 the epoxy resin is used rather of phenolic resin as a binder. It is used mainly in USA and Canada. Blind Buried Circuit does not offers FR3.
FR4:
The UL-designated rating of laminate made up of glass and epoxy that connects a particular standard for fire-retardance. It is known as FR4. It is the most frequent dielectric material which is used in the manufacturing of PCBs.
Flying Probe:
A testing device that utilizes multiple moving pins moving pins to make connection with two spots on the EC (Electrical Circuit), and deliver a signal among them. It is a process that resolve whether faults exist. It is known as Flying Probe.
First Article:
A instance part or assembly constructed prior to the start of formation for the purpose of assuring that the development is efficient of forming a product that will connect linked with specified requirements. It is called First Article.
Finished Copper:
The quantity of how much copper will applied on your board’s surface. It is the copper foil density, minus surface preparation, plus plated copper. It is given in OZ/per sq foot. A minimum of 0.0012″-0.0014″ compactness=1 OZ.
Files (Gerber):
Our industry standard format for files are applied to develop artwork essential for circuit board imaging. Blind Buried Circuit selects Gerber format is 274x, which inserts the apertures with in the particular files. Blind Buried Circuit will require “one” aperture list deliver with files, if files are not saved in 274x.
Fiducial Marks:
The fiducial Marks are the dots that are etched on the board panel for which SMT (Surface-Mount Technology) assembly is mandatory (delivers the viewing targets for camera to locate correct position). These marks should be in diameter of generally 0.06″ and free from solder mask. If fine-pitch elements are used there should be 2 sets of fiducials. The second set is called the local marks, one for each fine-pitch IC (Integrated Circuit) is located at the exact center position of that IC. The first set is called the panel mark, one for each panel control (at least, 5 from any panel tooling holes).
Feed-Thru (Via):
A plated-through hole in a PCB (Printed Board Circuit) that is used to deliver electrical connection among a trace on one side of the PCB (Printed Circuit Board) to a trace on the other side. Since it is not applied to mount element leads, it is commonly a small hole and diameter. It is called Feed Thru (Via).
G
Golden Board:
A board or assembly which is validate to be free of faults is known as Golden Board.
Ground Plane:
A portion of a conductive layer or a conductor layer, used as a frequent point for shielding, heat sinking, or circuit returns. It is known as ground plane.
Gerber:
A software format which is used by the photoplotter to explain the design of PCB (Printed Circuit Board). It is called Gerber.
Gold Fingers (Linear Inches):
By the help of Gold, we can plate your edge connectors (generally, Ni/Min 30 Au). The inputs need to be the distance among the outside edges of the outermost tabs.
Glass Epoxy:
A material which is used to manufacture PCBs (Printed Circuit Boards). The base object (Fiber glass) is impregnated with epoxy filler which must have copper laminated to its exterior surface to produce the material which is mandatory to fabricate the PCB. It is known as glass epoxy.
G10:
A laminate containing of woven epoxy glass cloth attached with epoxy resin under pressure and heat. It lacks the anti-flammability characteristics of FR4. It is used mainly for slender circuits such as watches.
H
Hole Pattern:
The arrangement of all holes in a PCB with respect to an exact point is known as Hole Pattern.
Hole Breakout:
A plight in which a hole is moderately surrounded by the land is known as Hole Breakout.
HASL:
The HASL stands for Hot Air Solder Leveling. A method of covering open copper with solder by interpose a panel into a bath of molten solder than passing the panel quickly past jets of hot air.
HDI:
The HDI stand for High density Interconnect. HDI is a multi-layer and ultra-fine geometry PCB manufactured with conductive micro via connections. These boards are commonly involve Buried and Blind vias and are composed by consecutive lamination.
HAL:
The process of placing solder on liable copper of the PCB (Printed Circuit Board). Generally 60/40 Tin/Lead mix is used. It is called HAL and it is also known as a SMOBC which is stands for solder Mask over bare Copper.
I
Inner-Layers:
The inter layers of metal foil and laminate with in a multilayer board is called as inner-layers, and it is also known as internal signal layers.
Impedance:
The total passive opposition allow to the electric current to flow. This term is commonly used to describe the high frequency circuit boards.
Imaging:
The process in which data is delivered to the photo plotter, which in return uses light to deliver a negative image circuitry pattern onto the panel. It is called Imaging.
Insulation Resistance:
The insulating object having electrical resistance that is resolved under particular situations among any pair of conductors, grounding devices or contacts in different amalgamation. It is called as Insulation Resistance.
Inkjetting:
The diffusion of well-defined ink “dots” onto a PCB surface, is known as inkjetting. The inkjet apparatus uses heat to liquefy the solid ink pellet and change the solid ink into liquid, then it is dropped by a nozzle onto a PCB (Printed Circuit Board) surface, where its rapidly dehydrated.
J
K
KGB:
A KGB stands for (known good board). A board or an assembly which is validate to be free from defects, is called a KGB and it is also known as a golden board.
L
Lot:
A common design which is share by the number of circuit boards is called as Lot.
Lot Code:
Some customers demand constructor lot code to be fixed on the board for future tracking objectives. Your order fabricate by how you choose it. A drawing can determine the location, what layer an if it is to be silk screen, copper or mask opening.
LPI:
The LPI stands for (Liquid photo imageable solder mask). A mask sprayed on applying Photo graphic imaging techniques to control deposition is known as LPI, Blind Buried Circuit standard is LPI-Green.
Layup:
The process in which treated copper foils and prepregs are gathered for pressing. It is called Layup.
Line:
A slender conductive area on a surface or internal layer of a PCB is usually made up of lands (to which element leads are connected) and paths (traces). It is called a Line.
Legend:
A format of symbols or lettering on the PCB (Printed Circuit Board) is called as legend. For e.g: serial number, patterns, component locations, and part numbers.
Land:
The allocation of the conductive pattern on PC (Printed Circuits) appointed for the mounting or connections of elements. It is called land, and it is also known as a Pad.
Layers:
The plains of copper associated by the plated through holes is called as layers. On board text such as logo, part number, or company name that is accurate reading on the top layer will assure that the layer are fixed perfectly.
Layer Sequence:
You must have to comprehend a pass through marks or layer sequence so that we are able to manufacture your order with an accurate assembled.
Laminate:
The plastic object commonly reinforced by paper or glass that helps the copper cladding from which circuit traces are constructed. It is called Laminate.
Laminate Void:
In any cross-sectional the absence of epoxy resin that should commonly accommodate epoxy resin. It is called Laminate Void.
Laminate Thickness:
The compactness of the metal-clad base material, double-sided or single-sided, anterior to any consequential processing. It is called as Laminate Thickness.
M
Minor Defect:
A fault that is not likely to result in the failure of product of a unit or that does not decrease the benefit for its contracted purpose. It is called as Minor Defect.
Metal Foil:
The plane of conductive material of a PCB (Printed Circuit Board) from which circuits are manufactured. It is called a Metal Foil. It is commonly a copper provided in rolls ad sheets.
Mask:
The object used to enable selective plating, etching or the activation of solder on the PCB (Printed Circuit Board). It is called a mask, or it is also known as resist or solder mask.
Measling:
These are distinct white spots or crosses down the surface of the base laminate that speculate a partition of fibers in the glass cloth at the compose intersection. It is called as Measling.
Major Defect:
A fault that is likely to result in failure of a product or unit by materially decreasing its benefits for its contracted purpose. It is known as Major defect.
Multi-layer Board:
A printed board containing of a number (Four or more) of discrete conducting circuits planes detach by insulating objects and tied together into relatively slender compatible constructions with external and internal connections to each level of a circuit as required. It is known as Multi-layer Board.
Microvia:
It is commonly defines as a conductive hole with a diameter of 0.005″ or lower that attaches layers of a multi-layer PCB (Printed Circuit Board). It is often used to require to any small geometry link holes manufactured by laser drilling. It is known as microvia.
Micro sectioning:
The formation of a specimen of an object or material, that is to require in metallographic examination. This is generally contains cutting out a cross-section followed by staining, polishing, etching and encapsulation. It is called micro–sectioning.
Minimum Traces and Spacing:
The wires of the PCB (Printed Circuit Board) is called traces and it is also known as tracks. The gap between pads, the gap between traces, or a gap between pad or trace. It is known as Spaces.
N
NPTH:
The NPTH stands for (Non-Plated Through Holes). The holes that do not copper n the holes barrel, this is defines as NPTH.
Number of Holes:
The total numbers of hole on the boar is known as number of holes.
Net List:
An ASCII list explains the logical links between element pins. Manufactured from schematic capture systems for delivering logical connections to layout systems. Other net-lists are manufactured from CAM/CAD system for board test and in-circuit test objectives.
Nomenclature:
The identification symbols used to the board by means of inkjetting, screen printing or laser processes. It is known as Nomenclature. See silk screen or legend.
O
Outer-Layer:
The bottom and top side of any type of circuit board is known as Outer-Layer.
P
Pattern Placing:
The selective plating of a conductive pattern is known as Pattern Placing.
Pulse Platting:
A process of plating that applies pulses instead of a direct current. It is called Pulse Platting.
Prepreg:
A sheet material which is joined with a resin fitter to an intermediate stage (B-Stage Resin). It is known as Prepreg.
Plating Void:
It is the area of absence of a particular metal from a particular cross-sectional area. It is known as Plating Void.
Pressing:
The process by which the fusion of pressure and heat are used to a book, thereby generating fully cured laminate sheets. It is called as Pressing.
Printing Wiring Board:
It is a part fabricated from rigid base material upon which entirely prepared printing wiring gas been composed. It is known as Printing Wiring Board.
Plotting:
The mechanical conversion of X-Y positional information into an optical pattern such as artwork, It is called as Plotting.
Platen:
A horizontal plate of metal within the lamination press in between which stacks are fixed during pressing. It is called as Platen.
Photographic Image:
An image in an emulsion or a photo mask that is on a plate or film. It is known as Photographic Plate.
Pattern:
The structure of nonconductive and conductive materials on a Printed Board or Panel. Also, the circuit structure on associated drawing, masters, and tools. It is called a Pattern.
PTH:
The PTH stands for (Plated-Through Holes). The holes that have copper plating in the hole barrels that produce an electrical connection among layers. It is defined as PTH’s.
Photo Print:
The process of manufacturing a circuit pattern image stiffening a photo sensitive polymeric material by glancing light through the photographic material. It is known as Photo Print.
Photo tool:
A limpid film that contains the circuit pattern, which is characterized by the series of lines of dots at a high resolution. It is called a Phototool.
Printed Board:
The general term for entirely processed printed wiring or printed circuit structures. It involves double-sided, single-sided, and multi-layer boards, both flexible and rigid. It is known as Printed Board.
Printed Circuit:
A conductive pattern that contains printed elements, printed wiring, or a fusion thereof, all fabricated in a predetermined design and contacted to be connected to a common base. It is known as a printed circuit. (In addition, this is a collective used to explain a printed board formed by any of a number of techniques).
Photoplotting:
An electronic visual process to scan rasterized image data on films it is called photoplotting, also it is known as laser plotting. A film manufactured by photoplotter, or indicated to as artwork is mandatory for PCB formation. It is called as Photoplotting.
Part Numbers:
The number or name associated with your PCB (Printed Circuit Board) it is called Part numbers. We use your part number throughout the entire order procedure for your convenience.
Pad:
The segment of the conductive pattern on printed circuits appropriated for the connection and mounting of elements is known as Pad.
Pad Sizes:
Your inner layer pads require to be 0.018″ bigger than your finish tool size. Your outer layer pads require to be 0.017″ bigger than the finish tool size (0.010″ for vias). If your project has any pad trace to junction minimum obligation, add that to above numbers [0.002″ junction + 0.017″ pad should have 0.019″ pad].
Q
Quantity:
Enter the numbers of board you require. If you do not know your yearned quantity, enter in an approximate for pricing.
R
Resin (Epoxy) Nonconductive:
It is a resin conveyed from the base material onto the top of the conductive pattern on the wall of a drilled hole. It is known as nonconductive epoxy resin.
Rough Holes:
The holes with a copper burr around or the exit or entry hole and that dearth a smooth barrel it is called Rough holes.
Resist:
The covering material used to protect or to mask selected areas of pattern from the action of a solder, plating, or etchant. It is called Resist and it is also known as solder mask or mask.
Router:
A machine that cuts away the portions of the laminate to fabricate the desired size and shape of the PB (Printed Board). It is called a Router.
Routing:
We proffer many choices regarding routing. Enormous routing can be multiply the PCB (Printed Circuit Board) costs. If your PCB requires routing you may need to deliver the files straight to us to quote on the PCB RFQ (Request Form Quote) form.
Rigid-Flex:
A PCB formation attaching flexible circuits and rigid multi-layers commonly to provide a built-in connections or to form a three-dimension from that embrace elements. It is called a Rigid-flex.
Registration:
The degree of assent to the position of a portion, or a pattern thereof, a hole or other component to its designed position on a product. It is known as registration.
Revision:
Enter it here, if you have the same drawing number but in advanced revisions. This will escape any confusion for constructing your desired boards. You have to make sure that your revision number is admitted with your drawing in your Readme File.
Reflow:
The melting of electrodeposited lead/pin hounded by solidification. The surface has the presence and physical qualities of being Hot-dipped. It is called as Reflow.
Readme File:
A text file admitted in the zip file, which supply essential information required to fabricate your order. Email addresses or phone numbers of engineer or designer contacts for this project should be admitted to expedite resolution of any potential fabricating problems that dally your order.
S
Stripping:
The process by which imaging object (resist) is chemically excluded from a panel during the construction is called stripping.
SMT:
The SMT stands for (Surface Mount Technology). The entire body of processes and elements that conceive PCB (Printed Circuit Board) assemblies with leadless elements. It is known as SMT.
Substrate:
A material whose surface adhesives substance is increase for covering or bonding. Also, any object that provides an encouraging surface for other materials used to base printed circuit patterns. It is known as Substrate.
Surface Mount:
The pitch of the surface mount is describes as the dimension in inches from center to center of top mount pads. It is called as Surface mount. The basic pitch is >0.025″, delicate pitch is 0.011″-0.025″, and ultra delicate pitch is <0.011″. As boards accommodate fine pitch, test fixture and processing costs increase.
Step-and-repeat:
A process by which successive exposures to a single image are composed to deliver a multiple image construction master. It is called as Step-and-Repeat.
Subtractive Processing:
The process of selectively abolishing copper from a board to compose a circuit it is known as subtractive processing. In this case, “subtractive” assign to the process of image deliver from image file or a phototool to the copper circuit.
Solder:
It is an alloy that melts at relatively low temperatures and it is used to seal or join the metals with higher melting points. It is known as solder. A metal alloy with a melting calefaction below 427 degree centigrade (800°F).
SMOBC:
The SMOBC stands for (Solder Mask Over Bare Copper). It is a process of manufacturing a PCB (Printed Circuit Board) that results in ultimate metallization being copper with no defensive metal. The non-covering areas are covered by solder resist, flaunting only the element terminal areas. This removes TIN/Lead under the pads.
Single-Sided Board:
A printed board having conductive pattern only on one side. It is known as Single-Sided Board.
Smallest Hole:
This is the ultimate size of the hole. We will choose a drill bigger than the described hole size to concede for plating density. Hole sizes larger than 0.020″ do not provoke special costs.
Size X and Y:
If your board is in cadent, so you have to convert into inches because all dimensions are in inches.
Solder Leveling:
The method by which the board is susceptible to hot air or hot oil to abolish any waste solder from lands and holes. It is known as Solder Leveling.
Slots / Cutouts:
The interior cutouts consistently long and slender, it is known as Slots. By choosing slots we will add up to 5 slots per board. Additional costs may be needed, If your design has more than 5 slots.
Solder Mask:
A covering material applied to protect or to mask sensitive areas of a pattern from the action of a solder, plating, etchant. It is called as Solder Mask, and it is also known as Mask or Resist. LPI-green is our standard color, but we also proffer additional color such as black, red and blue.
Screen Printing:
A process for transmission of an image to a surface by forcing appropriate media through a stencil with a squeegee. It is called a Screen Printing.
Solder Mask Color:
LPI GREEN is our standard solder mask color. We have varieties on the Blind Buried Circuit website for further colors of black and blue. Note that there is an increase of cost for further colors, or they can add an extra day in manufacturing time due to the additional procedure are needed for the non-standard colors.
Scoring:
A technique in which crease are machined on polar sides of a panel to a bottom that grants individual boards to be disconnected from the panel after element assembly. It is known as Scoring.
Solder Mask (Artwork):
To manufacture your soldermask artwork, Add your slightest space analysis to the pad extent. For boards with 0.006″ area, use a pad extent up to +0.006″ up to 0.010″ for 0.010″. Spaces bigger than 0.010″ should have a pad size of +0.010″.
Silk Screen:
The marking ink used to determine elements during later assembly and troubleshooting procedure. It is known as silk screen. This can fixed on two or one side (In white or yellow), reliant on the board design and application. We can add your company logo if it is provided on the drawing specs.
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Trace:
A general term for a conductor is called trace, and it is also known as track.
Twist:
The laminate fault in which planarity results are in a twisted arc from deviation is called Twist.
Top Side:
The side of the circuit board on which most of the elements will be positioned. It is known as Top side.
Thickness:
Blind Buried Circuit standard density is 0.062″. We also proffer 0.031″, 0.094″, 0.126“. Blind Buried Circuits resilience is within 10% of the given measurement.
Traveler:
The list of instructions explaining the board, including any particular processing demands. It is called traveler and it is also known as a routing sheet, production order, shop traveler, or job order.
Test Coupon:
The portion of a panel or printed board consisting printed coupons used to specify the acceptability of such a board. It is known as Test Coupon.
Thief:
An extra cathode is fixed as to divert to itself some of the current from segments of the board which otherwise would accept too high a current density. It is known as Thief.
Tooling Holes:
The general terms for hole placed on a panel of PCB’s or on a PCB for matriculation and hold-down purposes during the fabricating process. It is called a tooling hole, it is also known as pilot hole, manufacturing hole, or fabricating hole.
TG:
The TG stands for (Glass Transition Temperature). The point at which increasing temperatures cause the solid base laminate to start to expose soft, plastic-like symptoms. It is expressed in degree Celsius (°C).
Tab Routing With Perforation Holes:
The Tab Routing with perforation holes is the same as tab routing above with the exclusion that we add perforation holes with the tabs to make it facile to break apart your boards at a later date. We proffer tab routing if you plan your boards assembled.
Tab Routing (With and Without Perforation Holes):
Comparatively that finalizing the route path around the board corner, “Tabs” are left so as to leave boards connected in pallets for comfort in assembly.
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UL:
The UL stands for (Underwriters Laboratories). An independent device certification organization and safety testing. It is called UL.
UV Curing:
A hardening, polymerizing, or cross linking a low molecular weight resinous object in a wet covering in applying ultra violet light as a source of energy. It is known as UV Curing.
Underwriters Symbols:
A logotype denoting that a device has been identified (accepted) by Underwriters Laboratories (UL). It is called underwriters symbols.
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V-Scoring:
Comparatively than finishing a route path around the board edge, the edges are “scored” to permit breaking bards a part after assembly. This is another way to panelize/palletize the boards.
Void:
The removal of any substance in a localized area is called a Void.
Via:
A plated-through hole which is used as an inter-layers links but does not have element lead or other reinforcing object intercalate in it. It is known as Via.
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Wave Soldering:
A method in which assembled PCB’s (Printed Circuit Boards) are brought in link with a constantly flowing and rotating mass of solder, typically in a bath. It is known as Wave Soldering.
WIP:
An acronym for work in progress is called WIP.
Wicking:
The transfer of copper salts into the glass fibers of the insulating material is called as Wicking.
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Zip File:
It consist of all the files required for the procedure of your order. Due to the bid amount of orders collected, we are not able to acquire separate layer files deliver to us.